SOT337-1

SSOP14 (SOT337-1)

plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body

Package information

Package version Package name Package description Reference Issue date
SOT337-1 SSOP14 plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body MO-150 (JEDEC) 2003-02-19

Related documents

File name Title Type Date
SSOP14_SOT337-1_mk plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body Marcom graphics 2017-01-28
SSOP-TSSOP-VSO-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08
Nexperia_package_poster Nexperia package poster Leaflet 2019-03-01

Products in this package