Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT337-1 | SSOP14 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | MO-150 (JEDEC) | 2003-02-19 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SSOP14_SOT337-1_mk | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| SOT337-1 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SOT337-1_118 | SSOP14; Reel pack for SMD, 13''; Q1/T1 product orientation | Packing information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|
Automotive qualified products (AEC-Q100/Q101)
| Type number | Description | Quick access |
|---|