Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT530-1 | TSSOP8 | plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body | MO-153 (JEDEC) | 2003-02-18 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT530-1 | 3D model for products with SOT530-1 package | Design support | 2023-02-07 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT530-1 | plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-03 |
| SOT530-1_118 | TSSOP8; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2022-10-12 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|---|---|
| CBTD3306PW | Dual bus switch with level shifting | |
| CBT3306PW | Dual bus switch |
Automotive qualified products (AEC-Q100/Q101)
| Type number | Description | Quick access |
|---|