Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

WLCSP9_SOT8134

WLCSP9_SOT8134

WLCSP9: wafer level chip-scale package; 9 bumps; 1.500 × 1.500 × 0.663 mm body

Package information

Package information Package name Package description Reference Date
WLCSP9_SOT8134 WLCSP9 WLCSP9: wafer level chip-scale package; 9 bumps; 1.500 × 1.500 × 0.663 mm body 2025-07-08

Related documents

File name Title Type Date
WLCSP9_SOT8134 WLCSP9: wafer level chip-scale package; 9 bumps; 1.500 × 1.500 × 0.663 mm body Package information 2025-11-25
WLCSP9_SOT8134_341 WLCSP9; Reel dry pack for SMD, 7"; Q2/T3 product orientation Packing information 2025-09-03

Products in this package

GaN FETs

Type number Description Quick access
GANE011-080CBA AEC-Q101 qualified 80 V, 11 mOhm Gallium Nitride (GaN) FET in a 1.5 mm x 1.5 mm Wafer Level Chip-Scale Package (WLCSP)