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Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

GANE011-080CBA

AEC-Q101 qualified 80 V, 11 mOhm Gallium Nitride (GaN) FET in a 1.5 mm x 1.5 mm Wafer Level Chip-Scale Package (WLCSP)

The GANE011-080CBA​​ is a a general purpose 80 V, 11 mΩ Gallium Nitride (GaN) FET in a Wafer Level Chip-Scale Package (WLCSP). It is a normally-off e-mode device offering superior performance and very low on-state resistance. It passes AEC-Q101 qualification.

Features and benefits

  • Enhancement mode - normally-off power switch

  • Ultra high frequency switching capability

  • No body diode

  • Low gate charge, low output charge

  • Tested to AEC-Q101 standard

  • RoHS, Pb-free, REACH-compliant

  • High efficiency and high power density

  • Wafer Level Chip-Scale Package (WLCSP) 1.5 mm x 1.5 mm

Applications

  • LiDAR Application

  • Class-D Audio Amplifier

  • High Power Density and High switching frequency DC-to-DC Converters

  • AC-to-DC converters (secondary stage)

  • High Intensity Headlamps

  • Motor drives

Parametrics

Type number Package version Package name Product status Nr of transistors VDS [max] (V) RDSon [max] @ VGS = 5 V (mΩ) Tj [max] (°C) QGD [typ] (nC) Ptot [max] (W) VGSth [typ] (V) Ciss [typ] (pF) Coss [typ] (pF) Release date
GANE011‑080CBA WLCSP9_SOT8134 WLCSP9 Production 1 80 11 150 0.4 16.2 1.1 268 127 2025-11-24

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
GANE011‑080CBA GANE011‑080CBAZ
(934670834341)
Active 011 CCBA WLCSP9_SOT8134
WLCSP9
(WLCSP9_SOT8134)
WLCSP9_SOT8134 WLCSP9_SOT8134_341

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
GANE011‑080CBA GANE011‑080CBAZ GANE011‑080CBA rohs rhf rhf
Quality and reliability disclaimer

Documentation (3)

File name Title Type Date
GANE011-080CBA AEC-Q101 qualified 80 V, 11 mOhm Gallium Nitride (GaN) FET in a 1.5 mm x 1.5 mm Wafer Level Chip-Scale Package (WLCSP) Data sheet 2025-11-20
WLCSP9_SOT8134 WLCSP9: wafer level chip-scale package; 9 bumps; 1.500 × 1.500 × 0.663 mm body Package information 2025-11-25
WLCSP9_SOT8134_341 WLCSP9; Reel dry pack for SMD, 7"; Q2/T3 product orientation Packing information 2025-09-03

Support

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Longevity

The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.


Models

No documents available

Ordering, pricing & availability

Type number Orderable part number Ordering code (12NC) Status Packing Packing Quantity Buy online
GANE011‑080CBA GANE011‑080CBAZ 934670834341 Active WLCSP9_SOT8134_341 2,500

Sample

As a Nexperia customer you can order samples via our sales organization.

If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

Orderable parts

Type number Orderable part number Ordering code (12NC) Package Buy from distributors
GANE011-080CBA GANE011-080CBAZ 934670834341 WLCSP9_SOT8134 Order product