Features and benefits
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Supply voltage range from 2.3 V to 3.6 V
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High noise immunity
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Complies with JEDEC standard:
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JESD8-5 (2.3 V to 2.7 V)
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JESD8-B/JESD36 (2.7 V to 3.6 V)
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ESD protection:
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HBM JESD22-A114F exceeds 2000 V
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MM JESD22-A115-A exceeds 200 V
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CDM AEC-Q100-011 revision B exceeds 1000 V
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5 Ω switch connection between two ports
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Rail to rail switching on data I/O ports
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CMOS low power consumption
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Latch-up performance exceeds 250 mA per JESD78B Class I level A
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IOFF circuitry provides partial Power-down mode operation
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Multiple package options
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
Parametrics
Type number | Product status | VCC (V) | VPASS (V) | Logic switching levels | RON (Ω) | f(-3dB) (MHz) | Nr of bits | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
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74CBTLV3257BQ | Production | 2.3 - 3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 4 | 0.2 | very low | -40~125 | 93 | 13.7 | 62 | DHVQFN16 |
74CBTLV3257D | Production | 2.3 - 3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 4 | 0.2 | very low | -40~125 | 92 | 9.6 | 52 | SO16 |
74CBTLV3257DS | Production | 2.3 - 3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 4 | 0.2 | very low | -40~125 | 148 | 42.0 | 42 | SSOP16 |
74CBTLV3257GU | Production | 2.3 - 3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 4 | 0.2 | very low | -40~125 | - | - | - | XQFN16 |
74CBTLV3257PW | Production | 2.3 - 3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 4 | 0.2 | very low | -40~125 | 125 | 4.5 | 54.6 | TSSOP16 |
Package
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
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74CBTLV3257BQ | ![]() DHVQFN16 (SOT763-1) | SOT763-1 | SOT763-1_115 | Active | TV3257 | 74CBTLV3257BQ,115 ( 9352 900 04115 ) | |
74CBTLV3257D | ![]() SO16 (SOT109-1) | SOT109-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT109-1_118 | Active | 74CBTLV3257D | 74CBTLV3257D,118 ( 9352 900 05118 ) |
74CBTLV3257DS | ![]() SSOP16 (SOT519-1) | SOT519-1 | SSOP-TSSOP-VSO-REFLOW SSOP-TSSOP-VSO-WAVE | SOT519-1_118 | Active | TLV3257 | 74CBTLV3257DS,118 ( 9352 900 06118 ) |
74CBTLV3257GU | ![]() XQFN16 (SOT1161-1) | SOT1161-1 | SOT1161-1_115 | Active | Standard Marking | 74CBTLV3257GUX ( 9356 901 13115 ) | |
74CBTLV3257PW | ![]() TSSOP16 (SOT403-1) | SOT403-1 | SSOP-TSSOP-VSO-WAVE | SOT403-1_118 | Active | TLV3257 | 74CBTLV3257PW,118 ( 9352 900 07118 ) |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
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74CBTLV3257BQ | 74CBTLV3257BQ,115 | 74CBTLV3257BQ | ![]() | Always Pb-free | |
74CBTLV3257D | 74CBTLV3257D,118 | 74CBTLV3257D | ![]() | Always Pb-free | |
74CBTLV3257DS | 74CBTLV3257DS,118 | 74CBTLV3257DS | ![]() | Always Pb-free | |
74CBTLV3257GU | 74CBTLV3257GUX | 74CBTLV3257GU | ![]() | week 25, 2019 | |
74CBTLV3257PW | 74CBTLV3257PW,118 | 74CBTLV3257PW | ![]() | Always Pb-free |
Documentation (14)
File name | Title | Type | Date |
---|---|---|---|
74CBTLV3257 | Quad 1-of-2 multiplexer/demultiplexer | Data sheet | 2023-03-21 |
cbtlv3257 | IBIS model of 74CBTLV3257 | IBIS model | 2017-12-11 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
SOT1161-1 | plastic, leadless extermely thin quad flat package; 16 terminals; 0.4 mm pitch; 2.6 mm x 1.8 mm x 0.5 mm body | Package information | 2022-06-15 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
SOT519-1 | plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body | Package information | 2022-06-20 |
Support
If you are in need of design/technical support, let us know and fill in the answer form, we'll get back to you shortly.
Models
File name | Title | Type | Date |
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cbtlv3257 | IBIS model of 74CBTLV3257 | IBIS model | 2017-12-11 |
Ordering, pricing & availability
Sample
As a Nexperia customer you can order samples via our sales organization or directly via our Online Sample Store: https://extranet.nexperia.com.
Sample orders normally take 2-4 days for delivery.
If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples.