×

Chemical content 74CBTLV3257BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74CBTLV3257BQSOT763-1DHVQFN1621.96072 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935290004115812601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29544
PolymerResin systemProprietary0.0161219.900000.07340
subTotal0.08100100.000000.36884
DieDoped siliconSilicon (Si)7440-21-30.28156100.000001.28209
subTotal0.28156100.000001.28209
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.71806
Iron (Fe)7439-89-60.237082.320001.07957
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03723
Zinc (Zn)7440-66-60.012260.120000.05584
Gold alloyGold (Au)7440-57-50.003060.029970.01395
Silver (Ag)7440-22-40.002040.019980.00930
ImpurityNon hazardousProprietary0.000130.001280.00060
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02324
Nickel (Ni)7440-02-00.130671.278720.59503
subTotal10.21900100.0000046.53305
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.49974
FillerSilica -amorphous-7631-86-90.395003.490001.79866
Silica fused60676-86-09.5999384.8200043.71408
PigmentCarbon black1333-86-40.018110.160000.08246
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55660
Epoxy resin systemProprietary0.179961.590000.81945
Phenolic resinProprietary0.254662.250001.15959
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.90689
subTotal11.31800100.0000051.53747
WirePure metalCopper (Cu)7440-50-80.0590596.550000.26890
Pure metal layerGold (Au)7440-57-50.000210.350000.00097
Palladium (Pd)7440-05-30.001903.100000.00863
subTotal0.06116100.000000.27850
total21.96072100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.