Features and benefits
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Fully automotive qualified to beyond AEC-Q101:
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-55 °C to +175 °C rating suitable for thermally demanding environments
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LFPAK88 package:
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Designed for smaller footprint and improved power density over older wire bond packages such as D²PAK for today’s space constrained high power automotive applications
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Thin package and copper clip enables LFPAK88 to be highly efficient thermally
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LFPAK copper clip technology enabling improvements over wire bond packages by:
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Increased maximum current capability and excellent current spreading
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Improved RDSon
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Low source inductance
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Low thermal resistance Rth
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LFPAK Gull Wing leads:
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Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal cycling stress, unlike traditional QFN packages
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Visual (AOI) soldering inspection, no need for expensive x-ray equipment
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Easy solder wetting for good mechanical solder joint
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Unique 40 V Trench 9 superjunction technology:
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Reduced cell pitch and superjunction platform enables lower RDSon in the same footprint
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Improved SOA and avalanche capability compared to standard TrenchMOS
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Tight VGS(th) limits enable easy paralleling of MOSFETs
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Applications
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12 V automotive systems
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48 V DC/DC systems (on 12 V secondary side)
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Higher power motors, lamps and solenoid control
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Reverse polarity protection
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Ultra high performance power switching
Parametrics
Type number | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Date |
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BUK7S2R5-40H | SOT1235 | LFPAK88 | Production | N | 1 | 40 | 2.51 | 175 | 140 | 7 | 38 | 135 | 19.1 | 3 | Y | 2709 | 729 | 2021-01-28 |
PCB Symbol, Footprint and 3D Model
Model Name | Description |
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Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
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BUK7S2R5-40H | BUK7S2R5-40HJ ( 9346 613 17118 ) | Active | 7S2R540H | ![]() LFPAK88 (SOT1235) | SOT1235 | REFLOW_BG-BD-1 | SOT1235_118 |
BUK7S2R5-40H/A002 | BUK7S2R5-40H/A002J ( 9346 654 42118 ) | Active | 7S2R540H | ![]() LFPAK88 (SOT1235) | SOT1235 | REFLOW_BG-BD-1 | SOT1235_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
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BUK7S2R5-40H | BUK7S2R5-40HJ | BUK7S2R5-40H | ![]() | |
BUK7S2R5-40H/A002 | BUK7S2R5-40H/A002J | BUK7S2R5-40H/A002 | ![]() |
Documentation (14)
File name | Title | Type | Date |
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BUK7S2R5-40H | N-channel 40 V, 2.5 mOhm standard level MOSFET in LFPAK88 | Data sheet | 2021-04-06 |
AN10273 | Power MOSFET single-shot and repetitive avalanche ruggedness rating | Application note | 2022-06-20 |
AN11158 | Understanding power MOSFET data sheet parameters | Application note | 2020-07-06 |
AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
AN90003 | LFPAK MOSFET thermal design guide | Application note | 2023-08-22 |
AN90016 | Maximum continuous currents in NEXPERIA LFPAK power MOSFETs | Application note | 2020-09-03 |
AN90017 | Load switches for mobile and computing applications | Application note | 2020-09-02 |
SOT1235 | 3D model for products with SOT1235 package | Design support | 2020-01-22 |
BUK7xxxx-40H_LTspice_V3 | BUK7xxxx-40H Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2022-09-26 |
BUK7S2R5-40H | BUK7S2R5-40H SPICE model | SPICE model | 2021-04-12 |
TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2023-01-12 |
BUK7S2R5-40H_Cauer | BUK7S2R5-40H Cauer thermal model | Thermal model | 2021-04-12 |
SOT1235_118 | LFPAK88; Reel pack, SMD, 13"; Q1/T1 standard product orientation; Orderable part number ending ,118 or Z; Ordering code (12NC) ending 118 | Packing information | 2020-04-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Support
If you are in need of design/technical support, let us know and fill in the answer form, we'll get back to you shortly.
Models
File name | Title | Type | Date |
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SOT1235 | 3D model for products with SOT1235 package | Design support | 2020-01-22 |
BUK7xxxx-40H_LTspice_V3 | BUK7xxxx-40H Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2022-09-26 |
BUK7S2R5-40H | BUK7S2R5-40H SPICE model | SPICE model | 2021-04-12 |
BUK7S2R5-40H_Cauer | BUK7S2R5-40H Cauer thermal model | Thermal model | 2021-04-12 |
PCB Symbol, Footprint and 3D Model
Model Name | Description |
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Ordering, pricing & availability
Type number | Orderable part number | Ordering code (12NC) | Packing | Packing quantity | Buy online |
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BUK7S2R5-40H | BUK7S2R5-40HJ | 934661317118 | SOT1235_118 | - | Order product |
BUK7S2R5-40H/A002 | BUK7S2R5-40H/A002J | 934665442118 | SOT1235_118 | - | Order product |
Sample
As a Nexperia customer you can order samples via our sales organization or directly via our Online Sample Store: https://extranet.nexperia.com.
Sample orders normally take 2-4 days for delivery.
If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples.
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.