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PMCM950ENE

60 V, N-channel Trench MOSFET

N-channel enhancement mode Field-Effect Transistor (FET) in a 9 bumps Wafer Level Chip-Size Package (WLCSP) using Trench MOSFET technology.

This product has been discontinued, click here for discontinuation information and replacement parts.

Features and benefits

  • Low threshold voltage

  • Ultra small package: 1.48 × 1.48 × 0.35 mm

  • Trench MOSFET technology

  • ElectroStatic Discharge (ESD) protection > 2 kV HBM

Applications

  • High-speed line driver

  • Low-side load switch

  • Switching circuits

Parametrics

Type number Package version Package name Product status Channel type Nr of transistors VDS [max] (V) VGS [max] (V) RDSon [max] @ VGS = 10 V (mΩ) RDSon [max] @ VGS = 4.5 V (mΩ) integrated gate-source ESD protection diodes Tj [max] (°C) ID [max] (A) QGD [typ] (nC) QG(tot) [typ] @ VGS = 10 V (nC) Ptot [max] (W) VGSth [typ] (V) Automotive qualified Ciss [typ] (pF) Coss [typ] (pF) Release date
PMCM950ENE WLCSP9_3X3 WLCSP9 End of life N 1 60 20 41 47 Y 150 6.1 5.9 29.999998 0.78 1.2 N 1160 71 2019-05-13

Package

All type numbers in the table below are discontinued. See the table Discontinuation information for more information.

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
PMCM950ENE PMCM950ENEZ
(934660311023)
Discontinued / End-of-life WLCSP9_3X3
WLCSP9
(WLCSP9_3X3)
WLCSP9_3X3 Not available

Environmental information

All type numbers in the table below are discontinued. See the table Discontinuation information for more information.

Type number Orderable part number Chemical content RoHS RHF-indicator
PMCM950ENE PMCM950ENEZ PMCM950ENE rohs rhf rhf
Quality and reliability disclaimer

Documentation (5)

File name Title Type Date
PMCM950ENE 60 V, N-channel Trench MOSFET Data sheet 2019-05-13
WLCSP9_3X3 3D model for products with WLCSP9_3X3 package Design support 2023-03-13
nexperia_document_leaflet_SsMOS_for_mobile_2022 High volume small-signal MOSFETs for mobile and portables, in WLCSP and leadless DFN packages Leaflet 2022-07-04
WLCSP9_3X3 WLCSP9: wafer level chip-size package; 9 bumps (3 x 3) Package information 2020-04-21
PMCM950ENE PMCM950ENE SPICE model SPICE model 2020-02-19

Support

If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.

Models

File name Title Type Date
PMCM950ENE PMCM950ENE SPICE model SPICE model 2020-02-19
WLCSP9_3X3 3D model for products with WLCSP9_3X3 package Design support 2023-03-13

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.