Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 2PA1774QMB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
2PA1774QMBSOT883BXQFN30.680137 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065894315612601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00228076.0000000.335227
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00031410.4700000.046182
Phenolic resinProprietary0.00040613.5300000.059679
subTotal0.003000100.0000000.441088
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000004.410876
subTotal0.030000100.0000004.410876
Lead FrameCopper alloyChromium (Cr)7440-47-30.0006720.2400000.098804
Copper (Cu)7440-50-80.26320094.00000038.698086
Tin (Sn)7440-31-50.0006720.2400000.098804
Zinc (Zn)7440-66-60.0005880.2100000.086453
Pure metal layerGold (Au)7440-57-50.0002240.0800000.032935
Nickel (Ni)7440-02-00.0138324.9400002.033708
Palladium (Pd)7440-05-30.0008120.2900000.119388
subTotal0.280000100.00000041.168176
Mould CompoundFillerSilica -amorphous-7631-86-90.07820023.00000011.497684
Silica fused60676-86-00.20400060.00000029.993957
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0102003.0000001.499698
Ion trapping agentBismuth (Bi)7440-69-90.0017000.5000000.249950
PigmentCarbon black1333-86-40.0017000.5000000.249950
PolymerEpoxy resin systemProprietary0.0238007.0000003.499295
Phenolic resinProprietary0.0204006.0000002.999396
subTotal0.340000100.00000049.989928
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000132
Non hazardousProprietary0.0000110.0555000.001632
Tin solderTin (Sn)7440-31-50.01998899.9400002.938820
subTotal0.020000100.0000002.940584
WireImpurityNon hazardousProprietary0.0000010.0100000.000105
Pure metalGold (Au)7440-57-50.00713699.9900001.049242
subTotal0.007137100.0000001.049347
total0.680137100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.