Chemical content 2PA1774QMB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
2PA1774QMBSOT883BXQFN30.68014 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340658943156126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33523
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04618
Phenolic resinProprietary0.0004113.530000.05968
DieDoped siliconSilicon (Si)7440-21-30.03000100.000004.41086
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09880
Copper (Cu)7440-50-80.2632094.0000038.69792
Tin (Sn)7440-31-50.000670.240000.09880
Zinc (Zn)7440-66-60.000590.210000.08645
Pure metal layerGold (Au)7440-57-50.000220.080000.03293
Nickel (Ni)7440-02-00.013834.940002.03370
Palladium (Pd)7440-05-30.000810.290000.11939
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.49763
Silica fused60676-86-00.2040060.0000029.99382
Flame retardantMetal hydroxideProprietary0.010203.000001.49969
ImpurityBismuth (Bi)7440-69-90.001700.500000.24995
PigmentCarbon black1333-86-40.001700.500000.24995
PolymerEpoxy resin systemProprietary0.023807.000003.49928
Phenolic resinProprietary0.020406.000002.99938
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00163
Tin solderTin (Sn)7440-31-50.0199999.940002.93881
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0071499.990001.04924
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.