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Chemical content 74ABT16240ADGG

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Type numberPackagePackage descriptionTotal product weight
74ABT16240ADGGSOT362-1TSSOP48188.60321 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352122101181012601235Bangkok, Thailand; D-22529 HAMBURG, Germany; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-41.4418080.100000.76446
PolymerResin systemProprietary0.3582019.900000.18992
subTotal1.80000100.000000.95438
DieDoped siliconSilicon (Si)7440-21-31.12943100.000000.59884
subTotal1.12943100.000000.59884
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-864.5826097.0000034.24258
Nickel (Ni)7440-02-01.997403.000001.05905
subTotal66.58000100.0000035.30163
Mould CompoundAdditiveNon hazardousProprietary5.452004.700002.89072
FillerSilica fused60676-86-091.6400079.0000048.58878
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.960006.000003.69029
PigmentCarbon black1333-86-40.232000.200000.12301
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.640004.000002.46019
Non hazardousProprietary4.756004.100002.52170
Tetramethylbiphenyl diglycidyl ether85954-11-62.320002.000001.23010
subTotal116.00000100.0000061.50479
Pre-PlatingPure metal layerGold (Au)7440-57-50.028001.000000.01485
Nickel (Ni)7440-02-02.7160097.000001.44006
Palladium (Pd)7440-05-30.056002.000000.02969
subTotal2.80000100.000001.48460
WirePure metalCopper (Cu)7440-50-80.29378100.000000.15576
subTotal0.29378100.000000.15576
total188.60321100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.