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Chemical content 74AHC02BQ

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Type numberPackagePackage descriptionTotal product weight
74AHC02BQSOT762-1DHVQFN1421.89773 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352855381151112601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43163
PolymerResin systemProprietary0.0234819.900000.10723
subTotal0.11800100.000000.53886
DieDoped siliconSilicon (Si)7440-21-30.28449100.000001.29919
subTotal0.28449100.000001.29919
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.48199
Iron (Fe)7439-89-60.205522.346100.93854
Phosphorus (P)7723-14-00.002650.030200.01208
Zinc (Zn)7440-66-60.008890.101500.04060
Pure metal layerGold (Au)7440-57-50.002650.030200.01208
Nickel (Ni)7440-02-00.106921.220500.48825
Palladium (Pd)7440-05-30.004910.056000.02240
Silver (Ag)7440-22-40.001800.020500.00820
subTotal8.76000100.0000040.00414
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.68585
FillerSilica -amorphous-7631-86-90.442743.490002.02186
Silica fused60676-86-010.7602784.8200049.13872
PigmentCarbon black1333-86-40.020300.160000.09269
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62568
Epoxy resin systemProprietary0.201711.590000.92113
Phenolic resinProprietary0.285442.250001.30349
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.14352
subTotal12.68600100.0000057.93294
WirePure metalCopper (Cu)7440-50-80.0475396.550000.21707
Pure metal layerGold (Au)7440-57-50.000170.350000.00079
Palladium (Pd)7440-05-30.001533.100000.00697
subTotal0.04923100.000000.22483
total21.89773100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.