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Chemical content 74AHC123ABQ

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Type numberPackagePackage descriptionTotal product weight
74AHC123ABQSOT763-1DHVQFN1621.91570 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935285424115812601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29605
PolymerResin systemProprietary0.0161219.900000.07355
subTotal0.08100100.000000.36960
DieDoped siliconSilicon (Si)7440-21-30.23490100.000001.07183
subTotal0.23490100.000001.07183
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.80992
Iron (Fe)7439-89-60.237082.320001.08179
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03730
Zinc (Zn)7440-66-60.012260.120000.05595
Gold alloyGold (Au)7440-57-50.003060.029970.01397
Silver (Ag)7440-22-40.002040.019980.00932
ImpurityNon hazardousProprietary0.000130.001280.00060
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02329
Nickel (Ni)7440-02-00.130671.278720.59625
subTotal10.21900100.0000046.62862
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.50282
FillerSilica -amorphous-7631-86-90.395003.490001.80235
Silica fused60676-86-09.5999384.8200043.80388
PigmentCarbon black1333-86-40.018110.160000.08263
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55775
Epoxy resin systemProprietary0.179961.590000.82113
Phenolic resinProprietary0.254662.250001.16198
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.91080
subTotal11.31800100.0000051.64334
WirePure metalCopper (Cu)7440-50-80.0606396.550000.27667
Pure metal layerGold (Au)7440-57-50.000220.350000.00100
Palladium (Pd)7440-05-30.001953.100000.00888
subTotal0.06280100.000000.28655
total21.91570100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.