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Chemical content 74AHC126BQ

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Type numberPackagePackage descriptionTotal product weight
74AHC126BQSOT762-1DHVQFN1422.01312 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352896211151012601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.42937
PolymerResin systemProprietary0.0234819.900000.10667
subTotal0.11800100.000000.53604
DieDoped siliconSilicon (Si)7440-21-30.39829100.000001.80933
subTotal0.39829100.000001.80933
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.28027
Iron (Fe)7439-89-60.205522.346100.93362
Phosphorus (P)7723-14-00.002650.030200.01202
Zinc (Zn)7440-66-60.008890.101500.04039
Pure metal layerGold (Au)7440-57-50.002650.030200.01202
Nickel (Ni)7440-02-00.106921.220500.48569
Palladium (Pd)7440-05-30.004910.056000.02228
Silver (Ag)7440-22-40.001800.020500.00816
subTotal8.76000100.0000039.79445
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.67701
FillerSilica -amorphous-7631-86-90.442743.490002.01126
Silica fused60676-86-010.7602784.8200048.88115
PigmentCarbon black1333-86-40.020300.160000.09221
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62240
Epoxy resin systemProprietary0.201711.590000.91631
Phenolic resinProprietary0.285442.250001.29666
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.13228
subTotal12.68600100.0000057.62928
WirePure metalCopper (Cu)7440-50-80.0490896.550000.22296
Pure metal layerGold (Au)7440-57-50.000180.350000.00081
Palladium (Pd)7440-05-30.001583.100000.00716
subTotal0.05083100.000000.23093
total22.01312100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.