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Chemical content 74AHC126BQ

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Type numberPackagePackage descriptionTotal product weight
74AHC126BQSOT762-1DHVQFN1417.85195 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935289621115912601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0560780.100000.31408
PolymerResin systemProprietary0.0139319.900000.07803
subTotal0.07000100.000000.39211
DieDoped siliconSilicon (Si)7440-21-30.39829100.000002.23107
subTotal0.39829100.000002.23107
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.4622697.4700036.19919
Iron (Fe)7439-89-60.159122.400000.89133
Phosphorus (P)7723-14-00.001990.030000.01114
Zinc (Zn)7440-66-60.006630.100000.03714
subTotal6.63000100.0000037.13880
Mould CompoundFillerSilica -amorphous-7631-86-90.836307.980004.68466
Silica fused60676-86-08.3936480.0920047.01807
PigmentCarbon black1333-86-40.097250.928000.54478
PolymerEpoxy resin systemProprietary0.885568.450004.96058
Phenolic resinProprietary0.267242.550001.49698
subTotal10.48000100.0000058.70507
Pre-PlatingPure metal layerGold (Au)7440-57-50.006603.000000.03697
Nickel (Ni)7440-02-00.2030692.300001.13747
Palladium (Pd)7440-05-30.006823.100000.03820
Silver (Ag)7440-22-40.003521.600000.01972
subTotal0.22000100.000001.23236
WirePure metalCopper (Cu)7440-50-80.05366100.000000.30061
subTotal0.05366100.000000.30061
total17.85195100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.