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Chemical content 74AHC138BQ

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Type numberPackagePackage descriptionTotal product weight
74AHC138BQSOT763-1DHVQFN1621.16637 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352855721151712601235Shanghai, China; Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0720980.100000.34059
PolymerResin systemProprietary0.0179119.900000.08462
subTotal0.09000100.000000.42521
DieDoped siliconSilicon (Si)7440-21-30.38938100.000001.83964
subTotal0.38938100.000001.83964
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.6026697.4700035.91858
Iron (Fe)7439-89-60.187202.400000.88442
Phosphorus (P)7723-14-00.002340.030000.01106
Zinc (Zn)7440-66-60.007800.100000.03685
subTotal7.80000100.0000036.85091
Mould CompoundFillerSilica -amorphous-7631-86-91.001497.980004.73152
Silica fused60676-86-010.0515580.0920047.48828
PigmentCarbon black1333-86-40.116460.928000.55023
PolymerEpoxy resin systemProprietary1.060488.450005.01019
Phenolic resinProprietary0.320022.550001.51195
subTotal12.55000100.0000059.29217
Pre-PlatingPure metal layerGold (Au)7440-57-50.008103.000000.03827
Nickel (Ni)7440-02-00.2492192.300001.17739
Palladium (Pd)7440-05-30.008373.100000.03954
Silver (Ag)7440-22-40.004321.600000.02041
subTotal0.27000100.000001.27561
WirePure metalCopper (Cu)7440-50-80.06698100.000000.31645
subTotal0.06698100.000000.31645
total21.16637100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.