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Chemical content 74AHC138BQ

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Type numberPackagePackage descriptionTotal product weight
74AHC138BQSOT763-1DHVQFN1621.95893 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352855721151812601235Shanghai, China; Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29547
PolymerResin systemProprietary0.0161219.900000.07341
subTotal0.08100100.000000.36888
DieDoped siliconSilicon (Si)7440-21-30.27813100.000001.26660
subTotal0.27813100.000001.26660
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.72171
Iron (Fe)7439-89-60.237082.320001.07966
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03723
Zinc (Zn)7440-66-60.012260.120000.05584
Gold alloyGold (Au)7440-57-50.003060.029970.01395
Silver (Ag)7440-22-40.002040.019980.00930
ImpurityNon hazardousProprietary0.000130.001280.00060
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02325
Nickel (Ni)7440-02-00.130671.278720.59508
subTotal10.21900100.0000046.53685
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.49986
FillerSilica -amorphous-7631-86-90.395003.490001.79880
Silica fused60676-86-09.5999384.8200043.71765
PigmentCarbon black1333-86-40.018110.160000.08247
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55665
Epoxy resin systemProprietary0.179961.590000.81951
Phenolic resinProprietary0.254662.250001.15969
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.90704
subTotal11.31800100.0000051.54167
WirePure metalCopper (Cu)7440-50-80.0606396.550000.27613
Pure metal layerGold (Au)7440-57-50.000220.350000.00100
Palladium (Pd)7440-05-30.001953.100000.00887
subTotal0.06280100.000000.28600
total21.95893100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.