Chemical content 74AHC164BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC164BQ-Q100SOT762-1DHVQFN1417.75515 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301371115412601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0560780.100000.31580
PolymerResin systemProprietary0.0139319.900000.07846
DieDoped siliconSilicon (Si)7440-21-30.40925100.000002.30497
Lead Frame MaterialCopper alloyIron (Fe)7439-89-60.156482.400000.88132
Copper (Cu)7440-50-86.3550497.4700035.79268
Phosphorus (P)7723-14-00.001960.030000.01102
Zinc (Zn)7440-66-60.006520.100000.03672
Mould CompoundFillerSilica fused60676-86-08.3936480.0920047.27441
Silica -amorphous-7631-86-90.836307.980004.71021
PigmentCarbon black1333-86-40.097250.928000.54775
PolymerPhenolic resinProprietary0.267242.550001.50514
Epoxy resin systemProprietary0.885568.450004.98762
Pre-PlatingPure metal layerSilver (Ag)7440-22-40.003521.600000.01983
Gold (Au)7440-57-50.006603.000000.03717
Palladium (Pd)7440-05-30.006823.100000.03841
Nickel (Ni)7440-02-00.2030692.300001.14367
WirePure metalCopper (Cu)7440-50-80.05589100.000000.31481
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.