Chemical content 74AHC1G125GM

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Type numberPackagePackage descriptionTotal product weight
74AHC1G125GMSOT886XSON61.90998 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935285523115612601235Bangkok, Thailand; Nijmegen, Netherlands; Hsin-chu, Taiwan; Seremban, Malaysia 
935285523132912601235Nijmegen, Netherlands; Seremban, Malaysia; Hsin-chu, Taiwan; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.05520100.000002.89027
ComponentAdditiveNon hazardousProprietary0.000255.000000.01309
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01309
Silica -amorphous-7631-86-90.0025050.000000.13089
PolymerEpoxy resin systemProprietary0.0015030.000000.07853
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02618
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100038.20025
Magnesium (Mg)7439-95-40.001160.150000.06063
Nickel (Ni)7440-02-00.022772.950001.19237
Silicon (Si)7440-21-30.004940.640000.25868
Pure metal layerGold (Au)7440-57-50.000150.020000.00808
Nickel (Ni)7440-02-00.012661.640000.66288
Palladium (Pd)7440-05-30.000690.090000.03638
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22861
FillerSilica -amorphous-7631-86-90.003090.290000.16170
Silica fused60676-86-00.9175086.1500048.03702
HardenerPhenolic resinProprietary0.045694.290002.39209
PigmentCarbon black1333-86-40.002020.190000.10594
PolymerEpoxy resin systemProprietary0.092348.670004.83437
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalCopper (Cu)7440-50-80.0123396.490000.64550
Pure metal layerGold (Au)7440-57-50.000060.500000.00334
Palladium (Pd)7440-05-30.000383.000000.02007
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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