Chemical content 74AHC1G14GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC1G14GW-Q100SOT353-1UMT55.65642 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298659125712601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12888
PolymerResin systemProprietary0.0024325.000000.04296
DieDoped siliconSilicon (Si)7440-21-30.06536100.000001.15544
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.72713
Iron (Fe)7439-89-60.045512.310000.80452
Lead (Pb)7439-92-10.000200.010000.00348
Phosphorus (P)7723-14-00.001380.070000.02438
Zinc (Zn)7440-66-60.002360.120000.04179
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22638
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.14296
Silica fused60676-86-02.3217570.5700041.04633
PigmentCarbon black1333-86-40.006580.200000.11633
PolymerEpoxy resin systemProprietary0.5010715.230008.85838
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.47995
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0113599.990000.20061
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.