Chemical content 74AHC273PW

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Type numberPackagePackage descriptionTotal product weight
74AHC273PWSOT360-1TSSOP2079.82952 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352635931181112601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0594377.900000.07445
PolymerAcrylic resinProprietary0.0116015.200000.01453
Resin systemProprietary0.005266.900000.00659
DieDoped siliconSilicon (Si)7440-21-30.33908100.000000.42476
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-829.1435397.4700036.50721
Iron (Fe)7439-89-60.717602.400000.89892
Phosphorus (P)7723-14-00.008970.030000.01124
Zinc (Zn)7440-66-60.029900.100000.03745
Mould CompoundAdditiveNon hazardousProprietary2.285144.700002.86253
FillerSilica fused60676-86-038.4098079.0000048.11478
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.917206.000003.65429
PigmentCarbon black1333-86-40.097240.200000.12181
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.944804.000002.43619
Non hazardousProprietary1.993424.100002.49710
Tetramethylbiphenyl diglycidyl ether85954-11-60.972402.000001.21810
Pre-PlatingPure metal layerGold (Au)7440-57-50.007591.000000.00951
Nickel (Ni)7440-02-00.7362397.000000.92225
Palladium (Pd)7440-05-30.015182.000000.01902
WirePure metalCopper (Cu)7440-50-80.13515100.000000.16929
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.