Chemical content 74AHC32D-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC32D-Q100SOT108-1SO14141.71111 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9353001921181012601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01649
PolymerAcrylic resinProprietary0.0045615.200000.00322
Resin systemProprietary0.002076.900000.00146
DieDoped siliconSilicon (Si)7440-21-30.28449100.000000.20076
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.69393
Iron (Fe)7439-89-61.175702.400000.82964
Phosphorus (P)7723-14-00.014700.030000.01037
Zinc (Zn)7440-66-60.048990.100000.03457
Mould CompoundFillerSilica -amorphous-7631-86-90.546510.600000.38565
Silica fused60676-86-071.3464978.3300050.34643
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.556156.100003.92076
PigmentCarbon black1333-86-40.182170.200000.12855
PolymerEpoxy resin systemProprietary8.071918.862005.69603
Phenolic resinProprietary5.381275.908003.79735
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02633
Nickel (Ni)7440-02-01.1477892.300000.80994
Palladium (Pd)7440-05-30.038553.100000.02720
Silver (Ag)7440-22-40.019901.600000.01404
WirePure metalCopper (Cu)7440-50-80.08116100.000000.05727
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.