Chemical content 74AHC32PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC32PW-Q100SOT402-1TSSOP1459.74509 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300193118712601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.02608
PolymerAcrylic resinProprietary0.0030415.200000.00509
Resin systemProprietary0.001386.900000.00231
DieDoped siliconSilicon (Si)7440-21-30.28449100.000000.47618
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-818.7809297.4700031.43508
Iron (Fe)7439-89-60.462442.400000.77402
Phosphorus (P)7723-14-00.005780.030000.00968
Zinc (Zn)7440-66-60.019270.100000.03225
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39769
Silica fused60676-86-031.0186878.3300051.91838
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100004.04318
PigmentCarbon black1333-86-40.079200.200000.13256
PolymerEpoxy resin systemProprietary3.509358.862005.87388
Phenolic resinProprietary2.339575.908003.91592
Pre-PlatingPure metal layerGold (Au)7440-57-50.014673.000000.02456
Nickel (Ni)7440-02-00.4514692.300000.75564
Palladium (Pd)7440-05-30.015163.100000.02538
Silver (Ag)7440-22-40.007831.600000.01310
WirePure metalCopper (Cu)7440-50-80.08307100.000000.13904
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.