Chemical content 74AHC374D-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC374D-Q100SOT163-1SO20531.71844 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301376118812601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0467477.900000.00879
PolymerAcrylic resinProprietary0.0091215.200000.00172
Resin systemProprietary0.004146.900000.00078
DieDoped siliconSilicon (Si)7440-21-30.50463100.000000.09491
Lead FrameCopper alloyCopper (Cu)7440-50-8136.1310196.0970025.60209
Iron (Fe)7439-89-63.282262.317000.61729
Lead (Pb)7439-92-10.006370.004500.00120
Phosphorus (P)7723-14-00.114740.081000.02158
Zinc (Zn)7440-66-60.174240.123000.03277
Pure metal layerGold (Au)7440-57-50.038960.027500.00733
Nickel (Ni)7440-02-01.812541.279500.34088
Palladium (Pd)7440-05-30.069410.049000.01305
Silver (Ag)7440-22-40.030460.021500.00573
Mould CompoundAdditiveNon hazardousProprietary18.295694.700003.44086
FillerSilica fused60676-86-0307.5233079.0000057.83574
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-823.356206.000004.39259
PigmentCarbon black1333-86-40.778540.200000.14642
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-615.570804.000002.92839
Non hazardousProprietary15.960074.100003.00160
Tetramethylbiphenyl diglycidyl ether85954-11-67.785402.000001.46420
WirePure metalCopper (Cu)7440-50-80.22380100.000000.04209
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.