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Chemical content 74AHC594PW

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Type numberPackagePackage descriptionTotal product weight
74AHC594PWSOT403-1TSSOP1653.02839 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935282021118912601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1168577.900000.22035
PolymerAcrylic resinProprietary0.0228015.200000.04300
Resin systemProprietary0.010356.900000.01952
subTotal0.15000100.000000.28287
DieDoped siliconSilicon (Si)7440-21-30.38781100.000000.73132
subTotal0.38781100.000000.73132
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.8936397.4700037.51505
Iron (Fe)7439-89-60.489842.400000.92373
Phosphorus (P)7723-14-00.006120.030000.01155
Zinc (Zn)7440-66-60.020410.100000.03849
subTotal20.41000100.0000038.48882
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.80785
FillerSilica fused60676-86-025.0272079.0000047.19585
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.58450
PigmentCarbon black1333-86-40.063360.200000.11948
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.38966
Non hazardousProprietary1.298884.100002.44940
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.19483
subTotal31.68000100.0000059.74157
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00566
Nickel (Ni)7440-02-00.2910097.000000.54876
Palladium (Pd)7440-05-30.006002.000000.01131
subTotal0.30000100.000000.56573
WirePure metalCopper (Cu)7440-50-80.10059100.000000.18969
subTotal0.10059100.000000.18969
total53.02839100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.