Chemical content 74AHC594PW

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Type numberPackagePackage descriptionTotal product weight
74AHC594PWSOT403-1TSSOP1663.64352 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935282021118812601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.4005080.100000.62929
PolymerResin systemProprietary0.0995019.900000.15634
DieDoped siliconSilicon (Si)7440-21-30.54293100.000000.85308
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700058.19697
Iron (Fe)7439-89-60.912002.400001.43298
Phosphorus (P)7723-14-00.011400.030000.01791
Zinc (Zn)7440-66-60.038000.100000.05971
Mould CompoundAdditiveNon hazardousProprietary1.081004.700001.69852
FillerSilica fused60676-86-018.1700079.0000028.54965
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.380006.000002.16833
PigmentCarbon black1333-86-40.046000.200000.07228
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.920004.000001.44555
Non hazardousProprietary0.943004.100001.48169
Tetramethylbiphenyl diglycidyl ether85954-11-60.460002.000000.72278
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.02357
Nickel (Ni)7440-02-01.4550097.000002.28617
Palladium (Pd)7440-05-30.030002.000000.04714
WirePure metalCopper (Cu)7440-50-80.10059100.000000.15805
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.