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Chemical content 74AHC595BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC595BQ-Q100SOT763-1DHVQFN1621.74462 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352986311155126030 s123520 s3Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00458
FillerSilver (Ag)7440-22-40.0747675.000000.34381
PolymerAcrylic resinProprietary0.005986.000000.02750
Resin systemProprietary0.0179418.000000.08251
subTotal0.09968100.000000.45840
DieDoped siliconSilicon (Si)7440-21-30.42185100.000001.94000
subTotal0.42185100.000001.94000
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.67424
Iron (Fe)7439-89-60.196362.400000.90303
Phosphorus (P)7723-14-00.002450.030000.01129
Zinc (Zn)7440-66-60.008180.100000.03763
subTotal8.18167100.0000037.62619
Mould CompoundAdditiveNon hazardousProprietary0.371162.984001.70692
FillerSilica -amorphous-7631-86-90.434103.490001.99637
Silica fused60676-86-010.5503184.8200048.51918
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.124631.002000.57317
PigmentCarbon black1333-86-40.020400.164000.09381
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.460353.701002.11707
Epoxy resin systemProprietary0.197271.586000.90723
Phenolic resinProprietary0.280242.253001.28877
subTotal12.43847100.0000057.20252
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07526
Nickel (Ni)7440-02-00.5035192.300002.31554
Palladium (Pd)7440-05-30.016913.100000.07777
Silver (Ag)7440-22-40.008731.600000.04014
subTotal0.54551100.000002.50871
WirePure metalCopper (Cu)7440-50-80.0554796.550000.25508
Pure metal layerGold (Au)7440-57-50.000200.350000.00092
Palladium (Pd)7440-05-30.001783.100000.00819
subTotal0.05745100.000000.26419
total21.74462100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.