Chemical content 74AHC74BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHC74BQ-Q100SOT762-1DHVQFN1418.18750 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300322115612601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000231.000000.00128
FillerSilver (Ag)7440-22-40.0174475.000000.09592
PolymerAcrylic resinProprietary0.001406.000000.00767
Resin systemProprietary0.0041918.000000.02302
DieDoped siliconSilicon (Si)7440-21-30.21203100.000001.16580
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.08431
Iron (Fe)7439-89-60.166072.400000.91313
Phosphorus (P)7723-14-00.002080.030000.01141
Zinc (Zn)7440-66-60.006920.100000.03805
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68320
FillerSilica -amorphous-7631-86-90.367153.490002.01869
Silica fused60676-86-08.9230784.8200049.06157
PigmentCarbon black1333-86-40.016830.160000.09255
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62469
Epoxy resin systemProprietary0.167271.590000.91969
Phenolic resinProprietary0.236702.250001.30144
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14015
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07611
Nickel (Ni)7440-02-00.4258792.300002.34157
Palladium (Pd)7440-05-30.014303.100000.07864
Silver (Ag)7440-22-40.007381.600000.04059
WirePure metalCopper (Cu)7440-50-80.0492696.550000.27087
Pure metal layerGold (Au)7440-57-50.000180.350000.00098
Palladium (Pd)7440-05-30.001583.100000.00870
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.