Chemical content 74AHCT02D

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHCT02DSOT108-1SO14123.37945 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352626901181012601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06314
PolymerResin systemProprietary0.006906.900000.00559
Acrylic resinProprietary0.0152015.200000.01232
DieDoped siliconSilicon (Si)7440-21-30.39829100.000000.32282
Lead Frame MaterialCopper alloyIron (Fe)7439-89-61.068962.400000.86640
Zinc (Zn)7440-66-60.044540.100000.03610
Phosphorus (P)7723-14-00.013360.030000.01083
Copper (Cu)7440-50-843.4131497.4700035.18668
Mould CompoundAdditiveNon hazardousProprietary3.646734.700002.95570
FillerSilica fused60676-86-061.2961079.0000049.68096
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.655406.000003.77324
PigmentCarbon black1333-86-40.155180.200000.12577
PolymerNon hazardousProprietary3.181194.100002.57838
1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.103604.000002.51549
Tetramethylbiphenyl diglycidyl ether85954-11-61.551802.000001.25775
Pre-PlatingPure metal layerNickel (Ni)7440-02-00.6499097.000000.52675
Gold (Au)7440-57-50.006701.000000.00543
Palladium (Pd)7440-05-30.013402.000000.01086
WirePure metalCopper (Cu)7440-50-80.08116100.000000.06578
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.