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Chemical content 74AHCT02D

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Type numberPackagePackage descriptionTotal product weight
74AHCT02DSOT108-1SO14123.37945 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352626901181012601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06314
PolymerResin systemProprietary0.006906.900000.00559
Acrylic resinProprietary0.0152015.200000.01232
subTotal
DieDoped siliconSilicon (Si)7440-21-30.39829100.000000.32282
subTotal
Lead Frame MaterialCopper alloyIron (Fe)7439-89-61.068962.400000.86640
Zinc (Zn)7440-66-60.044540.100000.03610
Phosphorus (P)7723-14-00.013360.030000.01083
Copper (Cu)7440-50-843.4131497.4700035.18668
subTotal
Mould CompoundAdditiveNon hazardousProprietary3.646734.700002.95570
FillerSilica fused60676-86-061.2961079.0000049.68096
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.655406.000003.77324
PigmentCarbon black1333-86-40.155180.200000.12577
PolymerNon hazardousProprietary3.181194.100002.57838
1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.103604.000002.51549
Tetramethylbiphenyl diglycidyl ether85954-11-61.551802.000001.25775
subTotal
Pre-PlatingPure metal layerNickel (Ni)7440-02-00.6499097.000000.52675
Gold (Au)7440-57-50.006701.000000.00543
Palladium (Pd)7440-05-30.013402.000000.01086
subTotal
WirePure metalCopper (Cu)7440-50-80.08116100.000000.06578
subTotal
total123.37945100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.