Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AHCT123ABQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHCT123ABQSOT763-1DHVQFN1621.299651 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528542511510126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0009971.0000000.004680
FillerSilver (Ag)7440-22-40.07476075.0000000.350992
PolymerAcrylic resinProprietary0.0059816.0000000.028079
Resin systemProprietary0.01794218.0000000.084238
subTotal0.099680100.0000000.467989
DieDoped siliconSilicon (Si)7440-21-30.234899100.0000001.102830
subTotal0.234899100.0000001.102830
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.04357597.47000037.763883
Iron (Fe)7439-89-60.1980572.4000000.929859
Phosphorus (P)7723-14-00.0024760.0300000.011623
Zinc (Zn)7440-66-60.0082520.1000000.038744
subTotal8.252360100.00000038.744109
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.742581
FillerSilica -amorphous-7631-86-90.4341023.4900002.038072
Silica fused60676-86-010.55030284.82000049.532745
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.585143
PigmentCarbon black1333-86-40.0203990.1640000.095772
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603473.7010002.161291
Epoxy resin systemProprietary0.1972741.5860000.926184
Phenolic resinProprietary0.2802392.2530001.315695
subTotal12.438460100.00000058.397483
Pre-PlatingPure metal layerGold (Au)7440-57-50.0020951.0000000.009835
Nickel (Ni)7440-02-00.19062791.0000000.894976
Palladium (Pd)7440-05-30.0167588.0000000.078679
subTotal0.209480100.0000000.983490
WirePure metalCopper (Cu)7440-50-80.06253896.5500000.293609
Pure metal layerGold (Au)7440-57-50.0002270.3500000.001064
Palladium (Pd)7440-05-30.0020083.1000000.009427
subTotal0.064772100.0000000.304101
total21.299651100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.