Chemical content 74AHCT164BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT164BQ-Q100SOT762-1DHVQFN1418.26535 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301379115512601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10200
PolymerResin systemProprietary0.0046319.900000.02534
DieDoped siliconSilicon (Si)7440-21-30.29232100.000001.60042
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700036.92625
Iron (Fe)7439-89-60.166072.400000.90923
Phosphorus (P)7723-14-00.002080.030000.01137
Zinc (Zn)7440-66-60.006920.100000.03788
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.67603
FillerSilica -amorphous-7631-86-90.367153.490002.01008
Silica fused60676-86-08.9230784.8200048.85246
PigmentCarbon black1333-86-40.016830.160000.09215
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62203
Epoxy resin systemProprietary0.167271.590000.91577
Phenolic resinProprietary0.236702.250001.29590
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.13103
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07578
Nickel (Ni)7440-02-00.4258792.300002.33159
Palladium (Pd)7440-05-30.014303.100000.07831
Silver (Ag)7440-22-40.007381.600000.04042
WirePure metalCopper (Cu)7440-50-80.0469096.550000.25676
Pure metal layerGold (Au)7440-57-50.000170.350000.00093
Palladium (Pd)7440-05-30.001513.100000.00824
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.