Chemical content 74AHCT245BQ

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Type numberPackagePackage descriptionTotal product weight
74AHCT245BQSOT764-1DHVQFN2027.91993 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352891081151312601235Nijmegen, Netherlands; Shanghai, China; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000851.000000.00305
FillerSilver (Ag)7440-22-40.0639675.000000.22908
PolymerAcrylic resinProprietary0.005126.000000.01833
Resin systemProprietary0.0153518.000000.05498
DieDoped siliconSilicon (Si)7440-21-30.22953100.000000.82211
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.92689
Iron (Fe)7439-89-60.260742.400000.93387
Phosphorus (P)7723-14-00.003260.030000.01167
Zinc (Zn)7440-66-60.010860.100000.03891
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.70670
FillerSilica -amorphous-7631-86-90.571483.490002.04687
Silica fused60676-86-013.8892084.8200049.74654
PigmentCarbon black1333-86-40.026200.160000.09384
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.63342
Epoxy resin systemProprietary0.260361.590000.93253
Phenolic resinProprietary0.368442.250001.31961
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.17003
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00988
Nickel (Ni)7440-02-00.2509591.000000.89882
Palladium (Pd)7440-05-30.022068.000000.07902
WirePure metalCopper (Cu)7440-50-80.0873096.550000.31268
Pure metal layerGold (Au)7440-57-50.000320.350000.00113
Palladium (Pd)7440-05-30.002803.100000.01004
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.