Chemical content 74AHCT541ABQ

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Type numberPackagePackage descriptionTotal product weight
74AHCT541ABQSOT764-1DHVQFN2027.95421 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9353067941151512601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24436
PolymerResin systemProprietary0.0169719.900000.06071
DieDoped siliconSilicon (Si)7440-21-30.25933100.000000.92771
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.88038
Iron (Fe)7439-89-60.260742.400000.93273
Phosphorus (P)7723-14-00.003260.030000.01166
Zinc (Zn)7440-66-60.010860.100000.03886
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.70461
FillerSilica -amorphous-7631-86-90.571483.490002.04436
Silica fused60676-86-013.8892084.8200049.68553
PigmentCarbon black1333-86-40.026200.160000.09372
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.63264
Epoxy resin systemProprietary0.260361.590000.93138
Phenolic resinProprietary0.368442.250001.31800
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.16737
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00987
Nickel (Ni)7440-02-00.2509591.000000.89772
Palladium (Pd)7440-05-30.022068.000000.07892
WirePure metalCopper (Cu)7440-50-80.09490100.000000.33947
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.