Chemical content 74AHCT541APW

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Type numberPackagePackage descriptionTotal product weight
74AHCT541APWSOT360-1TSSOP2068.71877 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935306647118812601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0623277.900000.09069
PolymerAcrylic resinProprietary0.0121615.200000.01770
Resin systemProprietary0.005526.900000.00803
DieDoped siliconSilicon (Si)7440-21-30.25933100.000000.37738
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-829.8258297.4700043.40273
Iron (Fe)7439-89-60.734402.400001.06870
Phosphorus (P)7723-14-00.009180.030000.01336
Zinc (Zn)7440-66-60.030600.100000.04453
Mould CompoundAdditiveNon hazardousProprietary1.747464.700002.54292
FillerSilica fused60676-86-029.3722079.0000042.74262
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.230806.000003.24627
PigmentCarbon black1333-86-40.074360.200000.10821
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.487204.000002.16418
Non hazardousProprietary1.524384.100002.21829
Tetramethylbiphenyl diglycidyl ether85954-11-60.743602.000001.08209
Pre-PlatingPure metal layerGold (Au)7440-57-50.004601.000000.00669
Nickel (Ni)7440-02-00.4462097.000000.64931
Palladium (Pd)7440-05-30.009202.000000.01339
WirePure metalCopper (Cu)7440-50-80.13944100.000000.20291
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.