Chemical content 74AHCT541D

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Type numberPackagePackage descriptionTotal product weight
74AHCT541DSOT163-1SO20511.64550 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352619631181312601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-410.4130080.100002.03520
PolymerResin systemProprietary2.5870019.900000.50562
DieDoped siliconSilicon (Si)7440-21-30.33003100.000000.06450
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-8151.0785097.4700029.52796
Iron (Fe)7439-89-63.720002.400000.72707
Phosphorus (P)7723-14-00.046500.030000.00909
Zinc (Zn)7440-66-60.155000.100000.03029
Mould CompoundAdditiveNon hazardousProprietary15.980004.700003.12326
FillerSilica fused60676-86-0268.6000079.0000052.49729
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-820.400006.000003.98714
PigmentCarbon black1333-86-40.680000.200000.13290
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-613.600004.000002.65809
Non hazardousProprietary13.940004.100002.72454
Tetramethylbiphenyl diglycidyl ether85954-11-66.800002.000001.32905
Pre-PlatingPure metal layerGold (Au)7440-57-50.032001.000000.00625
Nickel (Ni)7440-02-03.1040097.000000.60667
Palladium (Pd)7440-05-30.064002.000000.01251
WirePure metalCopper (Cu)7440-50-80.11547100.000000.02257
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.