Chemical content 74AHCT86BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT86BQ-Q100SOT762-1DHVQFN1417.74503 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301403115412601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0560780.100000.31598
PolymerResin systemProprietary0.0139319.900000.07850
DieDoped siliconSilicon (Si)7440-21-30.39829100.000002.24452
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.3550497.4700035.81309
Iron (Fe)7439-89-60.156482.400000.88182
Phosphorus (P)7723-14-00.001960.030000.01102
Zinc (Zn)7440-66-60.006520.100000.03674
Mould CompoundFillerSilica -amorphous-7631-86-90.836307.980004.71289
Silica fused60676-86-08.3936480.0920047.30137
PigmentCarbon black1333-86-40.097250.928000.54807
PolymerEpoxy resin systemProprietary0.885568.450004.99047
Phenolic resinProprietary0.267242.550001.50600
Pre-PlatingPure metal layerGold (Au)7440-57-50.006603.000000.03719
Nickel (Ni)7440-02-00.2030692.300001.14432
Palladium (Pd)7440-05-30.006823.100000.03843
Silver (Ag)7440-22-40.003521.600000.01984
WirePure metalCopper (Cu)7440-50-80.05674100.000000.31976
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.