Chemical content 74AHCV05APW

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Type numberPackagePackage descriptionTotal product weight
74AHCV05APWSOT402-1TSSOP1459.62609 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935690682118612601235Shanghai, China; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.02613
PolymerAcrylic resinProprietary0.0030415.200000.00510
Resin systemProprietary0.001386.900000.00231
DieDoped siliconSilicon (Si)7440-21-30.17377100.000000.29143
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-818.7809297.4700031.49782
Iron (Fe)7439-89-60.462442.400000.77557
Phosphorus (P)7723-14-00.005780.030000.00969
Zinc (Zn)7440-66-60.019270.100000.03232
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39848
Silica fused60676-86-031.0186878.3300052.02199
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100004.05125
PigmentCarbon black1333-86-40.079200.200000.13283
PolymerEpoxy resin systemProprietary3.509358.862005.88560
Phenolic resinProprietary2.339575.908003.92373
Pre-PlatingPure metal layerGold (Au)7440-57-50.014673.000000.02461
Nickel (Ni)7440-02-00.4514692.300000.75715
Palladium (Pd)7440-05-30.015163.100000.02543
Silver (Ag)7440-22-40.007831.600000.01312
WirePure metalCopper (Cu)7440-50-80.07480100.000000.12544
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.