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Chemical content 74AUP1G00GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AUP1G00GW-Q100SOT353-1UMT56.74847 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690852125412601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.10802
PolymerResin systemProprietary0.0024325.000000.03601
subTotal0.00972100.000000.14403
DieDoped siliconSilicon (Si)7440-21-31.15717100.0000017.14716
subTotal1.15717100.0000017.14716
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400028.26934
Iron (Fe)7439-89-60.045512.310000.67433
Lead (Pb)7439-92-10.000200.010000.00292
Phosphorus (P)7723-14-00.001380.070000.02043
Zinc (Zn)7440-66-60.002360.120000.03503
Pure metal layerSilver (Ag)7440-22-40.012800.650000.18975
subTotal1.97000100.0000029.19180
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000006.82525
Silica fused60676-86-02.3217570.5700034.40414
PigmentCarbon black1333-86-40.006580.200000.09750
PolymerEpoxy resin systemProprietary0.305649.290004.52904
Phenolic resinProprietary0.195435.940002.89586
subTotal3.29000100.0000048.75179
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00014
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00023
Tin solderTin (Sn)7440-31-50.3099799.990004.59317
subTotal0.31000100.000004.59364
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0115799.990000.17151
subTotal0.01158100.000000.17153
total6.74847100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.