Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP1G08GM-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1G08GM-Q100SOT886XSON61.916888 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356907691154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.062910100.0000003.281882
subTotal0.062910100.0000003.281882
ComponentAdditiveNon hazardousProprietary0.0002505.0000000.013042
FillerBisphenol A-epichlorohydrin resin25068-38-60.0002505.0000000.013042
Silica -amorphous-7631-86-90.00250050.0000000.130420
PolymerEpoxy resin systemProprietary0.00150030.0000000.078252
Phenol Formaldehyde resin (generic)9003-35-40.00050010.0000000.026084
subTotal0.005000100.0000000.260839
Lead FrameCopper alloyCopper (Cu)7440-50-80.72961794.51000038.062589
Magnesium (Mg)7439-95-40.0011580.1500000.060410
Nickel (Ni)7440-02-00.0227742.9500001.188071
Silicon (Si)7440-21-30.0049410.6400000.257751
Pure metal layerGold (Au)7440-57-50.0001540.0200000.008055
Nickel (Ni)7440-02-00.0126611.6400000.660487
Palladium (Pd)7440-05-30.0006950.0900000.036246
subTotal0.772000100.00000040.273610
Mould CompoundAdditiveNon hazardousProprietary0.0043660.4100000.227791
FillerSilica -amorphous-7631-86-90.0030880.2900000.161121
Silica fused60676-86-00.91749886.15000047.863908
HardenerPhenolic resinProprietary0.0456884.2900002.383473
PigmentCarbon black1333-86-40.0020240.1900000.105562
PolymerEpoxy resin systemProprietary0.0923368.6700004.816948
subTotal1.065000100.00000055.558802
WireImpurityNon hazardousProprietary0.0000010.0100000.000062
Pure metalCopper (Cu)7440-50-80.01155896.4900000.602934
Pure metal layerGold (Au)7440-57-50.0000600.5000000.003124
Palladium (Pd)7440-05-30.0003593.0000000.018746
subTotal0.011978100.0000000.624867
total1.916888100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.