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Chemical content 74AUP1G14GW

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Type numberPackagePackage descriptionTotal product weight
74AUP1G14GWSOT353-1UMT55.49458 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352790221251512601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.13650
PolymerResin systemProprietary0.0025025.000000.04550
subTotal0.01000100.000000.18200
DieDoped siliconSilicon (Si)7440-21-30.08388100.000001.52660
subTotal0.08388100.000001.52660
Lead FrameCopper alloyCopper (Cu)7440-50-81.9034196.6200034.64167
Iron (Fe)7439-89-60.041962.130000.76368
Phosphorus (P)7723-14-00.000590.030000.01076
Zinc (Zn)7440-66-60.002560.130000.04661
MetallisationSilver (Ag)7440-22-40.021471.090000.39080
subTotal1.97000100.0000035.85352
Mould CompoundAdditiveNon hazardousProprietary0.090192.900001.64144
Triphenylphosphine603-35-00.001560.050000.02830
FillerSilica -amorphous-7631-86-92.2392072.0000040.75289
PigmentCarbon black1333-86-40.001560.050000.02830
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4665015.000008.49018
Phenol Formaldehyde resin (generic)9003-35-40.3110010.000005.66012
subTotal3.11000100.0000056.60123
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00017
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00028
Tin solderTin (Sn)7440-31-50.3099799.990005.64136
subTotal0.31000100.000005.64193
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0107099.990000.19480
subTotal0.01070100.000000.19482
total5.49458100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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