Chemical content 74AUP1G157GM-Q100

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Type numberPackagePackage descriptionTotal product weight
74AUP1G157GM-Q100SOT886XSON61.90603 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935690765115412601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04963100.000002.60379
ComponentAdditiveNon hazardousProprietary0.000255.000000.01312
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01312
Silica -amorphous-7631-86-90.0025050.000000.13116
PolymerEpoxy resin systemProprietary0.0015030.000000.07870
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02623
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100038.27942
Magnesium (Mg)7439-95-40.001160.150000.06075
Nickel (Ni)7440-02-00.022772.950001.19484
Silicon (Si)7440-21-30.004940.640000.25922
Pure metal layerGold (Au)7440-57-50.000150.020000.00810
Nickel (Ni)7440-02-00.012661.640000.66425
Palladium (Pd)7440-05-30.000690.090000.03645
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22909
FillerSilica -amorphous-7631-86-90.003090.290000.16204
Silica fused60676-86-00.9175086.1500048.13657
HardenerPhenolic resinProprietary0.045694.290002.39705
PigmentCarbon black1333-86-40.002020.190000.10616
PolymerEpoxy resin systemProprietary0.092348.670004.84439
WireImpurityNon hazardousProprietary0.000000.010000.00008
Pure metalCopper (Cu)7440-50-80.0139096.490000.72907
Pure metal layerGold (Au)7440-57-50.000070.500000.00378
Palladium (Pd)7440-05-30.000433.000000.02267
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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