×

Chemical content 74AUP1G17GV

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1G17GVSOT753SO510.39896 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935335327125512601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.07212
PolymerResin systemProprietary0.0025025.000000.02404
subTotal0.01000100.000000.09616
DieDoped siliconSilicon (Si)7440-21-30.08388100.000000.80662
subTotal0.08388100.000000.80662
Lead FrameCopper alloyCopper (Cu)7440-50-83.1906694.9600030.68245
Iron (Fe)7439-89-60.085682.550000.82393
Lead (Pb)7439-92-10.001010.030000.00969
Phosphorus (P)7723-14-00.005040.150000.04847
Tin (Sn)7440-31-50.006720.200000.06462
Pure metal layerSilver (Ag)7440-22-40.070902.110000.68176
subTotal3.36000100.0000032.31092
Mould CompoundFillerSilica fused60676-86-04.6008071.0000044.24289
PigmentCarbon black1333-86-40.019440.300000.18694
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2765619.7000012.27584
Phenolic resinProprietary0.583209.000005.60825
subTotal6.48000100.0000062.31392
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00013
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000020.005000.00021
Tin solderTin (Sn)7440-31-50.4399699.990004.23077
subTotal0.44000100.000004.23119
WireGold alloyGold (Au)7440-57-50.0248399.000000.23881
Palladium (Pd)7440-05-30.000251.000000.00241
subTotal0.02509100.000000.24122
total10.39896100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.