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Chemical content 74AUP1G17GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AUP1G17GW-Q100SOT353-1UMT55.67232 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691243125512601235Bangkok, Thailand; Shanghai, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12852
PolymerResin systemProprietary0.0024325.000000.04284
subTotal0.00972100.000000.17136
DieDoped siliconSilicon (Si)7440-21-30.08388100.000001.47876
subTotal0.08388100.000001.47876
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.63259
Iron (Fe)7439-89-60.045512.310000.80226
Lead (Pb)7439-92-10.000200.010000.00347
Phosphorus (P)7723-14-00.001380.070000.02431
Zinc (Zn)7440-66-60.002360.120000.04168
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22575
subTotal1.97000100.0000034.73006
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.12013
Silica fused60676-86-02.3217570.5700040.93128
PigmentCarbon black1333-86-40.006580.200000.11600
PolymerEpoxy resin systemProprietary0.305649.290005.38829
Phenolic resinProprietary0.195435.940003.44526
subTotal3.29000100.0000058.00096
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.46459
subTotal0.31000100.000005.46512
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0087299.990000.15380
subTotal0.00872100.000000.15382
total5.67232100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.