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Chemical content 74AUP1G74GX

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Type numberPackagePackage descriptionTotal product weight
74AUP1G74GXSOT1233-2X2SON81.05100 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935308441115712601235Bangkok, Thailand; Seremban, Malaysia; Ayutthaya, Thailand; Shanghai, China; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05068100.000004.82184
subTotal0.05068100.000004.82184
ComponentAdditiveNon hazardousProprietary0.000255.000000.02379
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02379
Silica -amorphous-7631-86-90.0025050.000000.23787
PolymerEpoxy resin systemProprietary0.0015030.000000.14272
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.04757
subTotal0.00500100.000000.47574
Lead FrameCopper alloyCopper (Cu)7440-50-80.3865594.5100036.77887
Magnesium (Mg)7439-95-40.000610.150000.05837
Nickel (Ni)7440-02-00.012072.950001.14800
Silicon (Si)7440-21-30.002620.640000.24906
Pure metal layerGold (Au)7440-57-50.000080.020000.00778
Nickel (Ni)7440-02-00.006711.640000.63821
Palladium (Pd)7440-05-30.000370.090000.03502
subTotal0.40900100.0000038.91531
Mould CompoundAdditiveNon hazardousProprietary0.002300.410000.21924
FillerSilica -amorphous-7631-86-90.001630.290000.15507
Silica fused60676-86-00.4841686.1500046.06689
HardenerPhenolic resinProprietary0.024114.290002.29399
PigmentCarbon black1333-86-40.001070.190000.10160
PolymerEpoxy resin systemProprietary0.048738.670004.63610
subTotal0.56200100.0000053.47289
WireGold alloyGold (Au)7440-57-50.0240899.000002.29132
Palladium (Pd)7440-05-30.000241.000000.02314
subTotal0.02433100.000002.31446
total1.05100100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.