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Chemical content 74AUP1T17GX

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Type numberPackagePackage descriptionTotal product weight
74AUP1T17GXSOT1226-3X2SON50.60631 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690082125712601235Seremban, Malaysia; Shanghai, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02706100.000004.46278
subTotal0.02706100.000004.46278
ComponentAdditiveNon hazardousProprietary0.000205.000000.03299
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03299
Silica -amorphous-7631-86-90.0020050.000000.32986
PolymerEpoxy resin systemProprietary0.0012030.000000.19792
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06597
subTotal0.00400100.000000.65973
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100039.43697
Magnesium (Mg)7439-95-40.000380.150000.06259
Nickel (Ni)7440-02-00.007462.950001.23097
Silicon (Si)7440-21-30.001620.640000.26706
Pure metal layerGold (Au)7440-57-50.000050.020000.00835
Nickel (Ni)7440-02-00.004151.640000.68434
Palladium (Pd)7440-05-30.000230.090000.03756
subTotal0.25300100.0000041.72784
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.21098
FillerSilica -amorphous-7631-86-90.000900.290000.14923
Silica fused60676-86-00.2687986.1500044.33178
HardenerPhenolic resinProprietary0.013384.290002.20758
PigmentCarbon black1333-86-40.000590.190000.09777
PolymerEpoxy resin systemProprietary0.027058.670004.46148
subTotal0.31200100.0000051.45882
WireGold alloyGold (Au)7440-57-50.0101599.000001.67447
Palladium (Pd)7440-05-30.000101.000000.01691
subTotal0.01026100.000001.69138
total0.60631100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.