Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP2G08GT

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP2G08GTSOT833-1XSON82.506455 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528071211520126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.101355100.0000004.043759
subTotal0.101355100.0000004.043759
ComponentAdditiveNon hazardousProprietary0.0007505.0000000.029923
FillerBisphenol A-epichlorohydrin resin25068-38-60.0007505.0000000.029923
Silica -amorphous-7631-86-90.00750050.0000000.299227
PolymerEpoxy resin systemProprietary0.00450030.0000000.179536
Phenol Formaldehyde resin (generic)9003-35-40.00150010.0000000.059845
subTotal0.015000100.0000000.598455
Lead FrameCopper alloyCopper (Cu)7440-50-80.98394393.44190039.256368
Magnesium (Mg)7439-95-40.0015340.1457000.061211
Nickel (Ni)7440-02-00.0306842.9140001.224216
Silicon (Si)7440-21-30.0066490.6314000.265261
Pure metal layerGold (Au)7440-57-50.0003690.0350000.014704
Nickel (Ni)7440-02-00.0285572.7120001.139353
Palladium (Pd)7440-05-30.0012640.1200000.050414
subTotal1.053000100.00000042.011526
Mould CompoundAdditiveNon hazardousProprietary0.0053380.4100000.212978
FillerSilica -amorphous-7631-86-90.0037760.2900000.150643
Silica fused60676-86-01.12167386.15000044.751372
HardenerPhenolic resinProprietary0.0558564.2900002.228478
PigmentCarbon black1333-86-40.0024740.1900000.098697
PolymerEpoxy resin systemProprietary0.1128838.6700004.503707
subTotal1.302000100.00000051.945876
WireGold alloyGold (Au)7440-57-50.03474999.0000001.386380
Palladium (Pd)7440-05-30.0003511.0000000.014004
subTotal0.035100100.0000001.400384
total2.506455100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.