Chemical content 74AUP2G157GN

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type numberPackagePackage descriptionTotal product weight
74AUP2G157GNSOT1116X2SON81.17843 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352922231155126030 s124020 s3Suzhou, China; Seremban, Malaysia; Bangkok, Thailand; Ayutthaya, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05068100.000004.30043
ComponentAdditiveNon hazardousProprietary0.000705.000000.05940
FillerBisphenol A-epichlorohydrin resin25068-38-60.000705.000000.05940
Silica -amorphous-7631-86-90.0070050.000000.59401
PolymerEpoxy resin systemProprietary0.0042030.000000.35641
Phenol Formaldehyde resin (generic)9003-35-40.0014010.000000.11880
Lead FrameCopper alloyCopper (Cu)7440-50-80.4728892.9033040.12778
Magnesium (Mg)7439-95-40.000740.144900.06259
Nickel (Ni)7440-02-00.014752.897201.25139
Silicon (Si)7440-21-30.003190.627700.27112
MetallisationGold (Au)7440-57-50.000210.042100.01818
Nickel (Ni)7440-02-00.016503.241801.40023
Palladium (Pd)7440-05-30.000730.143000.06177
Mould CompoundAdditiveMisc. phosphorus compounds (generic) 0.000580.100000.04930
Non hazardousProprietary0.020923.600001.77490
FillerSilica fused60676-86-00.5112888.0000043.38654
PigmentCarbon black1333-86-40.001160.200000.09861
PolymerPhenolic resinProprietary0.023824.100002.02142
Tetramethylbiphenyl diglycidyl ether85954-11-60.023244.000001.97212
WireGold alloyGold (Au)7440-57-50.0235299.000001.99566
Palladium (Pd)7440-05-30.000241.000000.02016
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.