Chemical content 74AVC16T245DGV-Q100

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Type numberPackagePackage descriptionTotal product weight
74AVC16T245DGV-Q100SOT480-1TSSOP48115.68057 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9353028471181612601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.9581777.900000.82829
PolymerAcrylic resinProprietary0.1869615.200000.16162
Resin systemProprietary0.084876.900000.07337
DieDoped siliconSilicon (Si)7440-21-31.80297100.000001.55858
Lead FrameCopper alloyCopper (Cu)7440-50-845.9683194.5850039.73728
Magnesium (Mg)7439-95-40.083590.172000.07226
Silicon (Si)7440-21-30.346280.712500.29934
ImpurityNon hazardousProprietary0.000000.000000.00000
Pure metal layerGold (Au)7440-57-50.014340.029500.01239
Nickel (Ni)7440-02-02.153014.430061.86117
Palladium (Pd)7440-05-30.023810.049000.02059
Silver (Ag)7440-22-40.010450.021500.00903
Mould CompoundFillerSilica -amorphous-7631-86-90.383100.600000.33117
Silica fused60676-86-050.0137078.3300043.23432
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.894856.100003.36690
PigmentCarbon black1333-86-40.127700.200000.11039
PolymerEpoxy resin systemProprietary5.658398.862004.89139
Phenolic resinProprietary3.772265.908003.26093
WirePure metalCopper (Cu)7440-50-80.19760100.000000.17082
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.