Chemical content 74CBTLV3126BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74CBTLV3126BQ-Q100SOT762-1DHVQFN1418.17214 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300957115612601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000231.000000.00128
FillerSilver (Ag)7440-22-40.0174475.000000.09600
PolymerAcrylic resinProprietary0.001406.000000.00768
Resin systemProprietary0.0041918.000000.02304
DieDoped siliconSilicon (Si)7440-21-30.19560100.000001.07639
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.11566
Iron (Fe)7439-89-60.166072.400000.91390
Phosphorus (P)7723-14-00.002080.030000.01142
Zinc (Zn)7440-66-60.006920.100000.03808
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68462
FillerSilica -amorphous-7631-86-90.367153.490002.02039
Silica fused60676-86-08.9230784.8200049.10304
PigmentCarbon black1333-86-40.016830.160000.09263
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62522
Epoxy resin systemProprietary0.167271.590000.92046
Phenolic resinProprietary0.236702.250001.30254
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14196
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07617
Nickel (Ni)7440-02-00.4258792.300002.34354
Palladium (Pd)7440-05-30.014303.100000.07871
Silver (Ag)7440-22-40.007381.600000.04062
WirePure metalCopper (Cu)7440-50-80.0502996.550000.27675
Pure metal layerGold (Au)7440-57-50.000180.350000.00100
Palladium (Pd)7440-05-30.001613.100000.00889
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.