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Chemical content 74CBTLV3253BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74CBTLV3253BQ-Q100SOT763-1DHVQFN1621.34255 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353013611155126030 s123520 s3Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00467
FillerSilver (Ag)7440-22-40.0747675.000000.35029
PolymerAcrylic resinProprietary0.005986.000000.02802
Resin systemProprietary0.0179418.000000.08407
subTotal0.09968100.000000.46705
DieDoped siliconSilicon (Si)7440-21-30.28156100.000001.31923
subTotal0.28156100.000001.31923
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0434197.4700037.68720
Iron (Fe)7439-89-60.198052.400000.92797
Phosphorus (P)7723-14-00.002480.030000.01160
Zinc (Zn)7440-66-60.008250.100000.03867
subTotal8.25219100.0000038.66544
Mould CompoundAdditiveNon hazardousProprietary0.371162.984001.73908
FillerSilica -amorphous-7631-86-90.434103.490002.03398
Silica fused60676-86-010.5503184.8200049.43322
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.124631.002000.58397
PigmentCarbon black1333-86-40.020400.164000.09558
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.460353.701002.15695
Epoxy resin systemProprietary0.197271.586000.92432
Phenolic resinProprietary0.280242.253001.31305
subTotal12.43847100.0000058.28015
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00982
Nickel (Ni)7440-02-00.1906491.000000.89322
Palladium (Pd)7440-05-30.016768.000000.07852
subTotal0.20949100.000000.98156
WirePure metalCopper (Cu)7440-50-80.0590596.550000.27669
Pure metal layerGold (Au)7440-57-50.000210.350000.00100
Palladium (Pd)7440-05-30.001903.100000.00888
subTotal0.06116100.000000.28657
total21.34255100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.