×

Chemical content 74CBTLVD3861BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74CBTLVD3861BQSOT815-1DHVQFN2450.31431 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352940941189126030 s123520 s3Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001271.000000.00253
FillerSilver (Ag)7440-22-40.0953975.000000.18959
PolymerAcrylic resinProprietary0.007636.000000.01517
Resin systemProprietary0.0228918.000000.04550
subTotal0.12719100.000000.25279
DieDoped siliconSilicon (Si)7440-21-30.48653100.000000.96698
subTotal0.48653100.000000.96698
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0783297.4700037.91828
Iron (Fe)7439-89-60.469762.400000.93366
Phosphorus (P)7723-14-00.005870.030000.01167
Zinc (Zn)7440-66-60.019570.100000.03890
subTotal19.57353100.0000038.90251
Mould CompoundAdditiveNon hazardousProprietary0.880352.984001.74970
FillerSilica -amorphous-7631-86-91.029633.490002.04640
Silica fused60676-86-025.0239484.8200049.73524
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.295611.002000.58753
PigmentCarbon black1333-86-40.048380.164000.09616
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-71.091883.701002.17013
Epoxy resin systemProprietary0.467911.586000.92997
Phenolic resinProprietary0.664692.253001.32107
subTotal29.50241100.0000058.63620
Pre-PlatingPure metal layerGold (Au)7440-57-50.004971.000000.00988
Nickel (Ni)7440-02-00.4521491.000000.89864
Palladium (Pd)7440-05-30.039758.000000.07900
subTotal0.49686100.000000.98752
WirePure metalCopper (Cu)7440-50-80.1233996.550000.24523
Pure metal layerGold (Au)7440-57-50.000450.350000.00089
Palladium (Pd)7440-05-30.003963.100000.00787
subTotal0.12779100.000000.25399
total50.31431100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.