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Chemical content 74HC03D

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Type numberPackagePackage descriptionTotal product weight
74HC03DSOT108-1SO14123.40034 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337486606531412601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06313
PolymerAcrylic resinProprietary0.0152015.200000.01232
Resin systemProprietary0.006906.900000.00559
subTotal0.10000100.000000.08104
DieDoped siliconSilicon (Si)7440-21-30.42172100.000000.34175
subTotal0.42172100.000000.34175
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.4131497.4700035.18073
Iron (Fe)7439-89-61.068962.400000.86625
Phosphorus (P)7723-14-00.013360.030000.01083
Zinc (Zn)7440-66-60.044540.100000.03609
subTotal44.54000100.0000036.09390
Mould CompoundAdditiveNon hazardousProprietary3.646734.700002.95520
FillerSilica fused60676-86-061.2961079.0000049.67255
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.655406.000003.77260
PigmentCarbon black1333-86-40.155180.200000.12575
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.103604.000002.51507
Non hazardousProprietary3.181194.100002.57794
Tetramethylbiphenyl diglycidyl ether85954-11-61.551802.000001.25753
subTotal77.59000100.0000062.87664
Pre-PlatingPure metal layerGold (Au)7440-57-50.006701.000000.00543
Nickel (Ni)7440-02-00.6499097.000000.52666
Palladium (Pd)7440-05-30.013402.000000.01086
subTotal0.67000100.000000.54295
WirePure metalCopper (Cu)7440-50-80.07863100.000000.06372
subTotal0.07863100.000000.06372
total123.40034100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.