Chemical content 74HC03D

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Type numberPackagePackage descriptionTotal product weight
74HC03DSOT108-1SO14123.40034 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9337486606531412601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06313
PolymerAcrylic resinProprietary0.0152015.200000.01232
Resin systemProprietary0.006906.900000.00559
DieDoped siliconSilicon (Si)7440-21-30.42172100.000000.34175
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.4131497.4700035.18073
Iron (Fe)7439-89-61.068962.400000.86625
Phosphorus (P)7723-14-00.013360.030000.01083
Zinc (Zn)7440-66-60.044540.100000.03609
Mould CompoundFillerSilica -amorphous-7631-86-90.465540.600000.37726
Silica fused60676-86-060.7762578.3300049.25128
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.732996.100003.83548
PigmentCarbon black1333-86-40.155180.200000.12575
PolymerEpoxy resin systemProprietary6.876038.862005.57213
Phenolic resinProprietary4.584025.908003.71475
Pre-PlatingPure metal layerGold (Au)7440-57-50.006701.000000.00543
Nickel (Ni)7440-02-00.6499097.000000.52666
Palladium (Pd)7440-05-30.013402.000000.01086
WirePure metalCopper (Cu)7440-50-80.07863100.000000.06372
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.