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Chemical content 74HC123BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC123BQ-Q100SOT763-1DHVQFN1621.74345 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299041115612601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36721
PolymerResin systemProprietary0.0198419.900000.09123
subTotal0.09968100.000000.45844
DieDoped siliconSilicon (Si)7440-21-30.41898100.000001.92693
subTotal0.41898100.000001.92693
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.67621
Iron (Fe)7439-89-60.196362.400000.90308
Phosphorus (P)7723-14-00.002450.030000.01129
Zinc (Zn)7440-66-60.008180.100000.03763
subTotal8.18167100.0000037.62821
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.66468
FillerSilica -amorphous-7631-86-90.434103.490001.99648
Silica fused60676-86-010.5503184.8200048.52179
PigmentCarbon black1333-86-40.019900.160000.09153
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61782
Epoxy resin systemProprietary0.197771.590000.90957
Phenolic resinProprietary0.279872.250001.28713
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.11661
subTotal12.43847100.0000057.20561
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07527
Nickel (Ni)7440-02-00.5035192.300002.31567
Palladium (Pd)7440-05-30.016913.100000.07777
Silver (Ag)7440-22-40.008731.600000.04014
subTotal0.54551100.000002.50885
WirePure metalCopper (Cu)7440-50-80.0571096.550000.26261
Pure metal layerGold (Au)7440-57-50.000210.350000.00095
Palladium (Pd)7440-05-30.001833.100000.00843
subTotal0.05914100.000000.27199
total21.74345100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.