Chemical content 74HC123BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC123BQ-Q100SOT763-1DHVQFN1621.48669 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352990411155126030 s123520 s3Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0720980.100000.33551
PolymerResin systemProprietary0.0179119.900000.08335
DieDoped siliconSilicon (Si)7440-21-30.58657100.000002.72994
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.7196297.4700035.92747
Iron (Fe)7439-89-60.190082.400000.88464
Phosphorus (P)7723-14-00.002380.030000.01106
Zinc (Zn)7440-66-60.007920.100000.03686
Mould CompoundFillerSilica -amorphous-7631-86-91.001497.980004.66098
Silica fused60676-86-010.0515580.0920046.78034
PigmentCarbon black1333-86-40.116460.928000.54203
PolymerEpoxy resin systemProprietary1.060488.450004.93550
Phenolic resinProprietary0.320022.550001.48941
Pre-PlatingPure metal layerGold (Au)7440-57-50.008103.000000.03770
Nickel (Ni)7440-02-00.2492192.300001.15983
Palladium (Pd)7440-05-30.008373.100000.03895
Silver (Ag)7440-22-40.004321.600000.02011
WirePure metalCopper (Cu)7440-50-80.07011100.000000.32632
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.